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Aluminum Nitride: A Review of the Knowledge Base for Physical Property Development

Published online by Cambridge University Press:  21 February 2011

G. W. Prohaska  and
G. R. Miller
G. W. Prohaska
Affiliation:
The Carborundum Company P.O. Box 51540 Phoenix, AZ 85076
G. R. Miller
Affiliation:
The Carborundum Company P.O. Box 51540 Phoenix, AZ 85076
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Abstract

The status of the publicly available knowledge base for aluminum nitride and its processing has been briefly reviewed in an attempt to clarify future research needs. Driving forces for the development of a scientific understanding of the property/process relationships have thus far been focused on thermal conductivity. Future developments may well be aimed at (1) retention of presently available properties while attempting to lower ceramic processing temperatures and (2) understanding metal-ALN and polymer-ALN interfaces. Progress has thus far been sufficient to define first generation ceramic powder requirements and sintering conditions to give adequate properties for packaged device evaluation. In addition, metal-ALN interfacial bonding, although not well developed, has shown sufficient promise to insure long-term interest in this material.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 167: Symposium K – Advanced Electronic Packaging Materials , 1989 , 215
Copyright
Copyright © Materials Research Society 1990

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