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Photodefinable Benzocyclobutene Formulations for Thin Film Microelectronic Applications. III. 1 to 20 Micron Patterned Films

Published online by Cambridge University Press:  15 February 2011

E. S. Moyer
Affiliation:
The Dow Chemical Company, Central Research and Development, Midland, MI.
G. S. Becker
Affiliation:
The Dow Chemical Company, Central Research and Development, Midland, MI.
E. W. Rutter Jr.
Affiliation:
The Dow Chemical Company, Central Research and Development, Midland, MI.
M. Radler
Affiliation:
The Dow Chemical Company, Central Research and Development, Midland, MI.
J. N. Bremmer
Affiliation:
The Dow Chemical Company, Central Research and Development, Midland, MI.
M. T. Bernius
Affiliation:
The Dow Chemical Company, Central Research and Development, Midland, MI.
D. Castillo
Affiliation:
The Dow Chemical Company, Central Research and Development, Midland, MI.
A. J. G. Strandjord
Affiliation:
The Dow Chemical Company, Central Research and Development, Midland, MI.
R. Heistand
Affiliation:
The Dow Chemical Company, Central Research and Development, Midland, MI.
P. Foster
Affiliation:
The Dow Chemical Company, Central Research and Development, Midland, MI.
R. F. Harris
Affiliation:
The Dow Chemical Company, Central Research and Development, Midland, MI.
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Abstract

Negative working photodefinable benzocyclobutene formulations capable of obtaining patterned dielectric films from 1 to 20 microns thick are being developed using bisaryl azides as photocrosslinkers. Three different formulations are used to cover this range of film thicknesses. The formulations are very sensitive to the 365 nm and 405 nm wavelengths of light (i-line and h-line) of the high pressure mercury spectrum and require low exposure doses to produce resolved patterns. Twenty five micron round and square vias with sloping sidewalls (geometry good for metallization) have been successfully patterned in 10 micron thick films. The photodefined patterns can be obtained with good film retention using several developing solvents including: Stoddard solvent, ProglydeTM DMM, and n-butyl butyrate.

Type
Research Article
Copyright
Copyright © Materials Research Society 1994

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