Physical Sciences Symposia
Nanoscale x-ray and Electron Microscopy Techniques and Applications in Material Science
Characterizing the Back-Contact Interface of Poly-Crystalline Cd(Se)Te Devices with XEDS, EELS, and HRSTEM
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- 30 July 2021, pp. 742-744
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Optimized Amplitude-Dividing Beam Splitter Gratings for 4D STEM Holography
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- 30 July 2021, pp. 746-747
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Analytical Sciences Symposia
Diffraction Imaging Across Disciplines
Symmetry Analysis in Metallic Glasses by Electron Nanodiffraction
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- 30 July 2021, pp. 748-752
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Multislice electron ptychography enables lattice vibration-limited resolution and linear phase-contrast imaging in thick samples
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- 30 July 2021, pp. 754-756
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Dose-efficient tcBF-STEM imaging with real-space information beyond the scan sampling limit
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- 30 July 2021, pp. 758-760
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Strategies for fast and reliable 4D-STEM orientation and phase mapping of nanomaterials and devices
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- 30 July 2021, pp. 762-763
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Unifying 3D electron diffraction and serial electron diffraction into a high-resolution, high-accuracy and high-throughput structural analysis technique
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- 30 July 2021, pp. 764-767
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Advances in Focused Ion Beam Instrumentation, Applications and Techniques in and Materials and Life Sciences
Imaging and Ion-Beam Milling of Biological Specimens with the Helium-Ion Microscope
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- 30 July 2021, pp. 768-769
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New Imaging modality for surface and sub-surface imaging using Scanning Transmission Helium Ion Microscopy
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- 30 July 2021, pp. 770-772
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Characterization of selective layer and biomolecules fouling in polymeric membranes for microalgae filtration applications using 3D FIB/SEM
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- 30 July 2021, pp. 774-775
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Forward modeling of volume electron microscopy (vEM) of stained resin-embedded biological samples
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- 30 July 2021, pp. 776-777
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Comparison of segmentation algorithms for FIB/SEM tomography of porous polymers: Importance of image contrast for machine learning segmentation
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- 30 July 2021, pp. 778-781
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Microscopy and Microanalysis for Real World Problem Solving
How Many Microscopies Does It Take to Get to the Root Cause of the Fail? Sample Prep, Imaging, and In-Situ Analysis for Integrated Circuit Failure Analysis at the 14nm Node
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- 30 July 2021, pp. 782-783
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Highly Accurate and Portable 3D Surface Analysis Tool (APSA) for Printed Circuit Boards (PCB) Reconstruction and Assurance
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- 30 July 2021, pp. 784-787
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Strain measurements in industrial applications: A case study of solder bumps in semiconductor devices
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- 30 July 2021, pp. 788-790
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The novel feature based inspection technique that can detect defects that can affect the deterioration of the electrical properties of semiconductor devices
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- 30 July 2021, pp. 792-793
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Advanced quality control scanning system for electronic materials
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- Published online by Cambridge University Press:
- 30 July 2021, pp. 794-795
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New Frontiers in In-Situ Electron Microscopy in Liquids and Gases (L&G EM FIG Sponsored)
Practical Aspects of Performing Quantitive EELS Measurements of Gas Compositions in Closed-Cell Gas Reaction S/TEM
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- Published online by Cambridge University Press:
- 30 July 2021, pp. 796-798
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Electron energy-loss spectroscopy for direct visualization of gas adsorption sites
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- Published online by Cambridge University Press:
- 30 July 2021, pp. 800-801
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Resolution Models for Energy-Filtered TEM Imaging over Thick Liquid or Amorphous Layers
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- 30 July 2021, pp. 802-803
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