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In Situ Visualization of the Electron Wind Force in the Elastic Regime

Published online by Cambridge University Press:  30 July 2021

Matthew Mecklenburg ,
Brian Zutter ,
William A. Hubbard ,
Xin Yi Ling  and
B. C. Regan
Matthew Mecklenburg
Affiliation:
The Aerospace Corporation, United States
Brian Zutter
Affiliation:
University of California, Los Angeles, Los Angeles, California, United States
William A. Hubbard
Affiliation:
University of California, Los Angeles, United States
Xin Yi Ling
Affiliation:
University of California, Los Angeles, United States
B. C. Regan
Affiliation:
Department of Physics and Astronomy, University of California, Los Angeles, California 90095, United States, United States

Abstract

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Type
Advanced Imaging and Spectroscopy for Nanoscale Materials Characterization
Information
Microscopy and Microanalysis , Volume 27 , Supplement S1 , August 2021 , pp. 106 - 107
Copyright
Copyright © The Author(s), 2021. Published by Cambridge University Press on behalf of the Microscopy Society of America

References

Lienig, J and Thiele, M, “Fundamentals of Electromigration-Aware Integrated Circuit Design” (Springer International Publishing, Cham). 2018CrossRefGoogle Scholar
Blech, I A, Electromigration in thin aluminum films on titanium nitride, Journal of applied physics 47, 1203–1208 (1976)CrossRefGoogle Scholar
Blech, I A and Herring, C. Stress generation by electromigration. Applied Physics Letters, 29, 131–133 (1976).CrossRefGoogle Scholar
Mecklenburg, M et al. , Science 347 (2015), p. 629-632.CrossRefGoogle Scholar
Witt, C., Electromigration in Bamboo Aluminum Interconnects, Ph.D. thesis, Stuttgart, Stuttgart (2000).Google Scholar
This work was supported by the Semiconductor Research Corporation (SRC), by National Science Foundation (NSF) awards DMR-1611036 and DMR-2004897, by NSF STC award DMR-1548924, and by The Aerospace Corporation's SERPA program.Google Scholar