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Highly Accurate and Portable 3D Surface Analysis Tool (APSA) for Printed Circuit Boards (PCB) Reconstruction and Assurance

Published online by Cambridge University Press:  30 July 2021

Mukhil Azhagan Mallaiyan Sathiaseelan  and
Navid Asadizanjani
Mukhil Azhagan Mallaiyan Sathiaseelan
Affiliation:
University of Florida, Gainesville, Florida, United States
Navid Asadizanjani
Affiliation:
University of Florida, United States

Abstract

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Type
Microscopy and Microanalysis for Real World Problem Solving
Information
Microscopy and Microanalysis , Volume 27 , Supplement S1 , August 2021 , pp. 784 - 787
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Copyright
Copyright © The Author(s), 2021. Published by Cambridge University Press on behalf of the Microscopy Society of America

References

Mehta, D.; Lu, H.; Paradis, O.P.; M. S., M.A.; Rahman, M.T.; Iskander, Y.; Chawla, P.; Woodard, D.L.; Tehranipoor, M.; Asadizanjani, N. The Big Hack Explained: Detection and Prevention of PCB Supply Chain Implants. 2020. 16. doi:10.1145/3401980.Google Scholar
U.S. Department of Commerce. Defense Industrial Base Assessment: Counterfeit Electronics. (Date last accessed: 12-Feb-2021).Google Scholar
U.S Government Accountability Office. DOD Needs to Improve Reporting and Oversight to Reduce Supply Chain Risk. (Date last accessed: 12-Feb-2021).Google Scholar
Azhagan, M.; Mehta, D.; Lu, H.; Agrawal, S.; Chawla, P.; Tehranipoor, M.; Woodard, D.; Asadi, N. A Review on Automatic Bill of Material Generation and Visual Inspection on PCBs. ISTFA 2019: Conference Proceedings from the 45th International Symposium for Testing and Failure Analysis. ISTFA, 2019, pp 256–265.CrossRefGoogle Scholar
Jordan, R.; Riley, M. The Big Hack: How China Used a Tiny Chip to Infiltrate U.S. Companies. (Date last accessed 12-Feb-2021).Google Scholar
Laidlaw, Jack; Counterfeit hardware may lead to malware and failure. Technical Report. May 31, 2017. (Date last accessed 12-Feb-2021).Google Scholar
3D Interference Measurement Sensor | KEYENCE America. https://www.keyence.com/products/measure/interference/. Accessed 1 Feb. 2021.Google Scholar
3D-A5000 Series Area Scan 3D Camera – Software | Cognex. https://www.cognex.com/products/machine-vision/3d-machine-vision-systems/3d-a5000-series-area-scan/software. Accessed 1 Feb. 2021.Google Scholar
“Automated Optical Measurement | SMT Inspection.” CyberOptics, https://www.cyberoptics.com/product-category/automated-optical-measurement/. Accessed 1 Feb. 2021.Google Scholar
Mittal, A., Moorthy, A. K., and Bovik, A. C.. "No-Reference Image Quality Assessment in the Spatial Domain." IEEE Transactions on Image Processing. Vol. 21, Number 12, December 2012, pp. 4695–4708CrossRefGoogle Scholar
Schönberger, Johannes & Zheng, Enliang & Pollefeys, Marc & Frahm, Jan-Michael. (2016). Pixelwise View Selection for Unstructured Multi-View Stereo. 9907. 10.1007/978-3-319-46487-9_31.CrossRefGoogle Scholar