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Dynamic automation in transmission electron microscopy: application to electron holography

Published online by Cambridge University Press:  30 July 2021

Christophe Gatel
Affiliation:
CEMES-CNRS, TOULOUSE, France
Julien Dupuy
Affiliation:
CEMES-CNRS, Toulouse, France
Martin Hÿtch
Affiliation:
CEMES-CNRS, Toulouse, United States

Abstract

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Type
Full System and Workflow Automation for Enabling Big Data and Machine Learning in Electron Microscopy
Copyright
Copyright © The Author(s), 2021. Published by Cambridge University Press on behalf of the Microscopy Society of America

References

Hÿtch, M., Houdellier, F., Hüe, F., and Snoeck, E., Nature 453, 1086 (2008).CrossRefGoogle Scholar
Schattschneider, P., Rubino, S., Hébert, C., Rusz, J., Kunes, J., Novak, P., Carlino, E., Fabrizioli, M., Panaccione, G., and Rossi, G., Nature 441, 486 (2006).CrossRefGoogle Scholar
Erasmus, S.J. and Smith, K.C.A., J. Microsc. 127, 185 (1982).CrossRefGoogle Scholar
Saxton, W.O., Smith, D.J., and Erasmus, S.J., J. Microsc. 130, 187 (1983).CrossRefGoogle Scholar
Koster, A.J., Van den Bos, A., and K.D. van der Mast, Ultramicroscopy 21, 209 (1987).CrossRefGoogle Scholar
Uhlemann, S. and Haider, M., Ultramicroscopy 72, 109 (1998).CrossRefGoogle Scholar
Dierksen, K., Typke, D., Hegerl, R., Koster, A.J., and Baumeister, W., Ultramicroscopy 40, 71 (1992).CrossRefGoogle Scholar
Kolb, U., Gorelik, T., Kübel, C., Otten, M.T., and Hubert, D., Ultramicroscopy 107, 507 (2007).CrossRefGoogle Scholar
Wolf, D., Lubk, A., Lichte, H., and Friedrich, H., Ultramicroscopy 110, 390 (2010).CrossRefGoogle Scholar
Korinek, A., Beck, F., Baumeister, W., Nickell, S., and Plitzko, J.M., J. Struct. Biol. 175, 394 (2011).CrossRefGoogle Scholar
Mastronarde, D.N., J. Struct. Biol. 152, 36 (2005).Google Scholar
Zheng, S.Q., Keszthelyi, B., Branlund, E., Lyle, J.M., Braunfeld, M.B., Sedat, J.W., and Agard, D.A., J. Struct. Biol. 157, 138 (2007).Google Scholar
Abrishami, V., Vargas, J., Li, X., Cheng, Y., Marabini, R., C.Ó.S. Sorzano, and J.M. Carazo, J. Struct. Biol. 189, 163 (2015).CrossRefGoogle Scholar
Schorb, M., Haberbosch, I., Hagen, W.J.H., Schwab, Y., and Mastronarde, D.N., Nat. Methods 16, 471 (2019).Google Scholar
Tan, Y.Z., Cheng, A., Potter, C.S., and Carragher, B., Microscopy 65, 43 (2016).CrossRefGoogle ScholarPubMed
Koster, A.J., Chen, H., Sedat, J.W., and Agard, D.A., Ultramicroscopy 46, 207 (1992).CrossRefGoogle Scholar
Tejada, A., Broek, W.V., Dekker, A.J., and Adv, Imaging Electron Phys (2013).Google Scholar
Doornbos, R. and van Loo, S., editors, From Scientific Instrument to Industrial Machine: Coping with Architectural Stress in Embedded Systems (Springer Netherlands, 2012).CrossRefGoogle Scholar
Janschek, K., Tchernykh, V., and Dyblenko, S., in Proc. 2005 IEEEASME Int. Conf. Adv. Intell. Mechatron. (2005), pp. 1437.Google Scholar
Gatel, C., Dupuy, J., Houdellier, F., and Hÿtch, M.J., Appl. Phys. Lett. 113, 133102 (2018).CrossRefGoogle Scholar