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Quantitative evaluation of adhesion of metallic coatings with an extended microbridge test

Published online by Cambridge University Press:  31 January 2011

Xiaomin Zhang ,
Jingtao Du ,
Bo Liu ,
Shengli Ma  and
Kewei Xu
Xiaomin Zhang
Affiliation:
State Key Laboratory for Mechanical Behavior of Materials, Xi’an Jiaotong University, Xi’an, 710049, People’s Republic of China
Jingtao Du
Affiliation:
State Key Laboratory for Mechanical Behavior of Materials, Xi’an Jiaotong University, Xi’an, 710049, People’s Republic of China
Bo Liu
Affiliation:
State Key Laboratory for Mechanical Behavior of Materials, Xi’an Jiaotong University, Xi’an, 710049, People’s Republic of China
Shengli Ma
Affiliation:
State Key Laboratory for Mechanical Behavior of Materials, Xi’an Jiaotong University, Xi’an, 710049, People’s Republic of China
Kewei Xu*
Affiliation:
State Key Laboratory for Mechanical Behavior of Materials, Xi’an Jiaotong University, Xi’an, 710049, People’s Republic of China
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

An extended microbridge test (eMBT) was proposed to assess the adhesion of metallic coatings on metallic substrates. Through loading on the backside of narrow striped freestanding coatings, a two-dimensional stable interfacial delamination was introduced. A cross-sectional scanning electron microscope (SEM) was used to examine the interfacial fracture process. A large deflection solution for elastic deformation of the coating was derived, and an approximate model was established for the estimate of interfacial crack extension force G. The eMBT samples of electroplated Ni coatings on C45 carbon steel substrate were tested, and the measured interfacial fracture toughness was about 5.28 J/m2. Cross-sectional SEM examination showed that the interface crack extended along the interface plane, and therefore the interfacial fracture proceeded by the debonding of Ni/steel interface.

Keywords

AdhesionCoatingMetal
Type
Articles
Information
Journal of Materials Research , Volume 22 , Issue 9 , September 2007 , pp. 2497 - 2504
Copyright
Copyright © Materials Research Society 2007

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References

REFERENCES

1Chalker, P.R., Bull, S.J.Rickerby, D.S.: A review of the methods for the evaluation of coating-substrate adhesion. Mater. Sci. Eng., A 140, 583 1991CrossRefGoogle Scholar
2Marshall, D.B.Evans, A.G.: Measurement of adherence of residually stressed thin films by indentation. 1. Mechanics of interface delamination. J. Appl. Phys. 56, 2632 1984CrossRefGoogle Scholar
3Evans, A.G.Hutchinson, J.W.: On the mechanics of delamination and spalling in compressed films. Int. J. Solids Struct. 20, 455 1984CrossRefGoogle Scholar
4Drory, M.D.Hutchinson, J.W.: Diamond coating of titanium alloys. Science 263, 1753 1994CrossRefGoogle ScholarPubMed
5Vlassak, J.J., Drory, M.D.Nix, W.D.: A simple technique for measuring the adhesion of brittle films to ductile substrates with application to diamond-coated titanium. J. Mater. Res. 12, 1900 1997CrossRefGoogle Scholar
6Sanchez, J.M., El-Mansy, S., Sun, B., Scherban, T., Fang, N., Pantuso, D., Ford, W., Elizalde, M.R., Martinez-Esnaola, J.M., Martin-Meizoso, A., Gil-Sevillano, J., Fuentes, M.Maiz, J.: Cross-sectional nanoindentation: A new technique for thin film interfacial adhesion characterization. Acta Mater. 47, 4405 1999CrossRefGoogle Scholar
7Zheng, X.J.Zhou, Y.C.: Investigation of an anisotropic plate model to evaluate the interface adhesion of thin film with cross-sectional nanoindentation method. Comp. Sci. Technol. 65, 1382 2005CrossRefGoogle Scholar
8de Boer, M.P., Kriese, M.Gerberich, W.W.: Investigation of a new fracture mechanics specimen for thin film adhesion measurement. J. Mater. Res. 12, 2673 1997CrossRefGoogle Scholar
9de Boer, M.P., Nelson, J.C.Gerberich, W.W.: Thin film scratch testing in two dimensions—experiments and analysis. J. Mater. Res. 13, 1002 1998CrossRefGoogle Scholar
10Bagchi, A., Lucas, G.E., Suo, Z.Evans, A.G.: A new procedure for measuring the decohesion energy for thin ductile films on substrates. J. Mater. Res. 9, 1734 1994CrossRefGoogle Scholar
11Kriese, M.D., Gerberich, W.W.Moody, N.R.: Quantitative adhesion measures of multilayer films: Part 1. Indentation mechanics. J. Mater. Res. 14, 3007 1999CrossRefGoogle Scholar
12Kriese, M.D., Gerberich, W.W.Moody, N.R.: Quantitative adhesion measures of multilayer films: Part 2. Indentation of W/Cu, W/W, Cr/W. J. Mater. Res. 14, 3019 1999CrossRefGoogle Scholar
13Bagchi, A.Evans, A.G.: Measurement of debond energy for thin metallization lines on dielectrics. Thin Solid Films 286, 203 1996CrossRefGoogle Scholar
14Hutchinson, J.W.Suo, Z.: Mixed mode cracking in layered materials. Adv. Appl. Mech. 29, 63 1992CrossRefGoogle Scholar
15Allen, M.G.Senturia, S.D.: Analysis of critical debonding pressures of stressed thin films in the blister test. J. Adhesion 25, 303 1988CrossRefGoogle Scholar
16Allen, M.G.Senturia, S.D.: Application of the island blister test for thin film adhesion measurement. J. Adhesion 29, 219 1989CrossRefGoogle Scholar
17Jensen, H.M.: The blister test for interface toughness measurement. Eng. Fract. Mech. 40, 475 1991CrossRefGoogle Scholar
18Jensen, H.M.Thouless, M.D.: Effects of residual stresses in the blister test. Int. J. Solids Struct. 30, 779 1993CrossRefGoogle Scholar
19Zhang, T.Y., Su, Y.J., Qian, C.F., Zhao, M.H.Chen, L.Q.: Microbridge testing of silicon nitride thin films deposited on silicon wafers. Acta Mater. 48, 2843 2000CrossRefGoogle Scholar
20Su, Y.J., Qian, C.F., Zhao, M.H.Zhang, T.Y.: Microbridge testing of silicon oxide/silicon nitride bilayer films deposited on silicon wafers. Acta Mater. 48, 4901 2000CrossRefGoogle Scholar
21Liu, X.H., Suo, Z.Ma, Q.: Split singularities: Stress field near the edge of a silicon die on a polymer substrate. Acta Mater. 47, 67 1998CrossRefGoogle Scholar
22He, M.Y., Evans, A.G.Hutchinson, J.W.: Convergent debonding of films and fibers. Acta Mater. 45, 3481 1997CrossRefGoogle Scholar
23Volinsky, A.A., Moody, N.R.Gerberich, W.W.: Interfacial toughness measurements for thin films on substrates. Acta Mater. 50, 441 2002CrossRefGoogle Scholar
24Cotterell, B.Chen, Z.: The blister test—transition from plate to membrane behavior for an elastic material. Int. J. Fract. 86, 191 1997CrossRefGoogle Scholar
25Evans, A.G., Hutchinson, J.W.Wei, Y.: Interface adhesion: effects of plasticity and segregation. Acta Mater. 47, 4093 1999CrossRefGoogle Scholar
26Gaudette, F., Suresh, S., Evans, A.G., Dehm, G.Ruhle, M.: The influence of chromium addition on the toughness of γ-Ni/α-Al2O3 interfaces. Acta Mater. 45, 3503 1997CrossRefGoogle Scholar
27Timoshenko, S.Woinowski-Krieger, S. Theory of Plates and Shells,,(McGraw-Hill, New York, London, 1959Google Scholar